The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Nov. 13, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Hsin-Yu Pan, Taipei, TW;
Han-Ping Pu, Tai-Chung, TW;
Pei-Haw Tsao, Tai-Chung, TW;
Yu-Chen Hsu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a functional circuit region and a first portion of a seal ring spaced apart from the functional circuit region by a buffer zone. The device also includes a passivation layer over the interconnect structure and a second portion of the seal ring over the passivation layer and connected the first portion of the seal ring. The second portion of the seal ring is disposed in the buffer zone.