The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
Mar. 13, 2017
United Microelectronics Corp., Hsin-Chu, TW;
Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, CN;
Chien-Ting Ho, Taichung, TW;
Li-Wei Feng, Kaohsiung, TW;
Ying-Chiao Wang, Changhua County, TW;
Yu-Chieh Lin, Kaohsiung, TW;
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, CN;
Abstract
A semiconductor device includes a substrate including at least a memory region defined therein and a plurality of memory cells formed in the memory region, a plurality of first connecting structures, a plurality of second connecting structures, a plurality of dummy nodes respectively disposed on the first connecting structures, and a plurality of first storage nodes respectively disposed on the second connecting structures. The first connecting structures respectively include a conductive portion and a first metal portion, and the second connecting structures respectively include the conductive portion and a second metal portion. The first metal portion and the second metal portion include the same material. And the first metal portion and the second metal portion include different heights.