The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Jun. 23, 2014
Applied Materials, Inc., Santa Clara, CA (US);
Wei Lu, Fremont, CA (US);
Zhefu Wang, Milpitas, CA (US);
Zhihong Wang, Santa Clara, CA (US);
Hassan G. Iravani, San Jose, CA (US);
Dominic J. Benvegnu, La Honda, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.