The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Mar. 11, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Shifang Li, Pleasanton, CA (US);

Youxian Wen, Fremont, CA (US);

Sven Schwitalla, Portland, OR (US);

Prashant Aji, San Jose, CA (US);

Lena Nicolaides, Castro Valley, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/40 (2017.01); G06T 5/50 (2006.01); G06K 9/62 (2006.01); H04N 5/225 (2006.01); H04N 9/07 (2006.01);
U.S. Cl.
CPC ...
G06K 9/6201 (2013.01); G06T 5/50 (2013.01); G06T 7/001 (2013.01); H04N 5/2256 (2013.01); G06T 2207/10016 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/20224 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.


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