The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Apr. 15, 2014
Jsr Corporation, Minato-ku, JP;
Hitoshi Hamaguchi, Tokyo, JP;
Kenrou Tanaka, Tokyo, JP;
Kenzou Ookita, Tokyo, JP;
Keisuke Kuriyama, Tokyo, JP;
JSR CORPORATION, Minato-ku, JP;
Abstract
Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating filmand (ii) a step of irradiating a predetermined portion of the coating filmwith radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating filmand heating the ink to form a pattern. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.