The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2017
Filed:
Oct. 26, 2015
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Zidong Wang, Southborough, MA (US);
Michael K. Gallagher, Hopkinton, MA (US);
Kevin Y. Wang, Shrewsbury, MA (US);
Gregory P. Prokopowicz, Worcester, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); C09D 7/12 (2006.01); C07F 7/08 (2006.01); C08F 32/00 (2006.01); C09D 165/02 (2006.01); C08K 5/544 (2006.01); C08L 65/00 (2006.01); H01L 21/02 (2006.01); C09D 165/00 (2006.01); C09D 183/14 (2006.01); C09D 5/00 (2006.01); C09D 133/08 (2006.01); C09D 135/06 (2006.01); C09D 143/04 (2006.01); C08G 77/48 (2006.01); C08G 77/50 (2006.01);
U.S. Cl.
CPC ...
C09D 7/1233 (2013.01); C07F 7/0805 (2013.01); C08F 32/00 (2013.01); C08K 5/544 (2013.01); C08L 65/00 (2013.01); C09D 5/00 (2013.01); C09D 133/08 (2013.01); C09D 135/06 (2013.01); C09D 143/04 (2013.01); C09D 165/00 (2013.01); C09D 165/02 (2013.01); C09D 183/14 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02304 (2013.01); C08G 77/48 (2013.01); C08G 77/50 (2013.01); C08G 2261/3324 (2013.01); C08G 2261/3325 (2013.01); C08G 2261/3422 (2013.01); C08G 2261/418 (2013.01);
Abstract
Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.