The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Dec. 31, 2014
Applicant:

Crossbar, Inc., Santa Clara, CA (US);

Inventors:

Sundar Narayanan, Cupertino, CA (US);

Steve Maxwell, Sunnyvale, CA (US);

Natividad Vasquez, Jr., San Francisco, CA (US);

Harry Yue Gee, Santa Clara, CA (US);

Assignee:

CROSSBAR, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2463 (2013.01); H01L 27/092 (2013.01); H01L 45/1233 (2013.01); H01L 45/1253 (2013.01); H01L 45/16 (2013.01);
Abstract

Provided is a monolithic integration of resistive memory with complementary metal oxide semiconductor using integrated circuit foundry processes. A memory device is provided that includes a substrate comprising one or more complementary metal-oxide semiconductor devices, a first insulator layer formed on the substrate; and a monolithic stack. The monolithic stack includes multiple layers fabricated as part of a monolithic process over the first insulator layer. The multiple layers include a first metal layer, a second insulator layer, and a second metal layer. A resistive memory device structure is formed within the second insulator layer and within a thermal budget of the one or more complementary metal-oxide semiconductor devices. The resistive memory device structure is implemented as a pillar device or as a via device. Further, the first metal layer is coupled to the second metal layer.


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