The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Sep. 05, 2014
Applicant:

Fujifilm Planar Solutions, Llc, North Kingstown, RI (US);

Inventors:

Luling Wang, Chandler, AZ (US);

Abhudaya Mishra, Gilbert, AZ (US);

Deepak Mahulikar, Kingstown, RI (US);

Richard Wen, Mesa, AZ (US);

Assignee:

FUJIFILM PLANAR SOLUTIONS, LLC, North Kingstown, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 21/321 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); C09G 1/02 (2013.01);
Abstract

The present disclosure relates to polishing compositions that can polish Cobalt (Co) films in semiconductor substrates containing a multitude of films including Co, metals, metal oxides and dielectrics. These polishing compositions comprise an abrasive, a weak acid acting as a removal rate enhancer (RRE), a pH adjuster, and an azole-containing corrosion inhibitor (CI). The RRE, pH adjuster and CI have a pKa in the 1-18 range (1 (pKa)<pKa<18 (pKa)). The pKa values of the individual components are related to the pH of the polishing composition/slurry (pH) by the following equation: pKa+6<pH<pKa−6. The polishing composition also has less than about 100 parts per million (ppm) of sulfate ions and less than about 100 ppm of halide ions, and operates in the 7-12 pH range.


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