The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Apr. 14, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Nobutaka Mizutani, Nirasaki, JP;

Mitsuaki Iwashita, Nirasaki, JP;

Takashi Tanaka, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); H01L 21/445 (2006.01); H01L 21/768 (2006.01); C23C 18/18 (2006.01); C23C 18/31 (2006.01); H01L 21/311 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/1608 (2013.01); C23C 18/1886 (2013.01); C23C 18/1889 (2013.01); C23C 18/31 (2013.01); C23C 18/32 (2013.01); H01L 21/02063 (2013.01); H01L 21/02068 (2013.01); H01L 21/76865 (2013.01); H01L 21/76874 (2013.01); H01L 21/76879 (2013.01); H01L 23/53209 (2013.01); H01L 21/31133 (2013.01);
Abstract

A plating method includes forming a catalyst layeron a surface of a substrate including an inner surface of a recess; drying the substrate having the catalyst layer formed thereon such that an inside of the recess is dried as well; removing the catalyst layer at least on the surface of the substrate at the outside of the recess by supplying a processing liquid, which is configured to dissolve a material of the surface of the substrate, onto the surface of the substrate while rotating the dried substrate and while preventing or suppressing the processing liquid from being introduced into the dried inside of the recess; and forming a plating layeron the inside of the recess, at which the catalyst layer is not removed, by an electroless plating process.


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