The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jan. 20, 2016
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Kuan-Chun Lin, Tainan, TW;

Chih-Chieh Chou, Chiayi County, TW;

Shih-Cheng Chen, Tainan, TW;

Chung-Chih Hung, Kaohsiung, TW;

Yung-Teng Tsai, Tainan, TW;

Chi-Hung Chan, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/22 (2006.01); H01J 37/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01J 37/222 (2013.01); H01J 37/263 (2013.01); H01L 22/34 (2013.01); H01J 2237/221 (2013.01); H01J 2237/24592 (2013.01);
Abstract

A test structure for electron beam inspection and a method for defect determination using electron beam inspection are provided. The test structure for electron beam inspection includes a semiconductor substrate, at least two conductive regions disposed on the semiconductor substrate, a connection structure disposed on the two conductive regions, and a cap dielectric layer disposed on the connection structure. The method for defect determination using the electron beam inspection includes the following steps. An electron beam inspection is preformed to a test structure with an instant detector and a lock-in amplifier. Signals received by the detector within a period of time are amplified by the lock-in amplifier. A defect in the test structure is determined by monitoring the signals received by the detector and amplified by the lock-in amplifier. The inspection accuracy is improved by the test structure and the method for defect determination in the present invention.


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