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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9704811 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Dec. 22, 2015

Perforated conductive material for emi shielding of semiconductor device and components

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rajendra C. Dias, Phoenix, AZ (US);

Joshua D Heppner, Chandler, AZ (US);

Mitul B Modi, Phoenix, AZ (US);

Anna M. Prakash, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/49524 (2013.01);
Abstract

An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.

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