The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Oct. 04, 2013
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

Jeffrey Blackwood, Portland, OR (US);

Sang Hoon Lee, Hillsboro, OR (US);

Michael Schmidt, Gresham, OR (US);

Stacey Stone, Beaverton, OR (US);

Karey Holland, North Plains, OR (US);

Assignee:

FEI Company, Hillsboro, OR (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/305 (2006.01); G01R 31/265 (2006.01); G01N 1/28 (2006.01); H01L 21/66 (2006.01); G01N 1/32 (2006.01); H01J 37/30 (2006.01); H01J 37/153 (2006.01); G01R 31/307 (2006.01); G01R 31/28 (2006.01); G01R 31/312 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2653 (2013.01); G01N 1/286 (2013.01); G01N 1/32 (2013.01); G01R 31/307 (2013.01); H01J 37/153 (2013.01); H01J 37/3005 (2013.01); H01L 22/14 (2013.01); G01R 31/2808 (2013.01); G01R 31/2898 (2013.01); G01R 31/312 (2013.01); H01J 2237/208 (2013.01); H01J 2237/24564 (2013.01); H01J 2237/2817 (2013.01); H01J 2237/31749 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Multiple planes within the sample are exposed from a single perspective for contact by an electrical probe. The sample can be milled at a non-orthogonal angle to expose different layers as sloped surfaces. The sloped edges of multiple, parallel conductor planes provide access to the multiple levels from above. The planes can be accessed, for example, for contacting with an electrical probe for applying or sensing a voltage. The level of an exposed layer to be contacted can be identified, for example, by counting down the exposed layers from the sample surface, since the non-orthogonal mill makes all layers visible from above. Alternatively, the sample can be milled orthogonally to the surface, and then tilted and/or rotated to provide access to multiple levels of the device. The milling is preferably performed away from the region of interest, to provide electrical access to the region while minimizing damage to the region.


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