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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9668358 B1

PDFFull Text
Date of Patent:
May. 30, 2017

Filed:

Dec. 06, 2012

Cu ball

Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyoshi Kawasaki, Tochigi-ken, JP;

Takahiro Hattori, Tochigi-ken, JP;

Takahiro Roppongi, Tochigi-ken, JP;

Daisuke Soma, Tochigi-ken, JP;

Isamu Sato, Saitama-ken, JP;

Assignee:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Attorney:

Chernoff Vilhauer, McClung & Stenzel, LLP

Primary Examiner:

Scott Kastler

Assistant Examiner:

Vanessa Luk

Int. Cl.
CPC ...
C22C 9/00 (2006.01); B23K 35/30 (2006.01); H05K 3/34 (2006.01); B22F 1/02 (2006.01); B22F 1/00 (2006.01); B23K 35/02 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3484 (2013.01); B22F 1/0007 (2013.01); B22F 1/0048 (2013.01); B22F 1/02 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/302 (2013.01); C22C 9/00 (2013.01); H01L 23/488 (2013.01); H01L 23/49816 (2013.01); H01L 2924/0002 (2013.01); H05K 3/3463 (2013.01); H05K 2203/041 (2013.01);
Abstract

A Cu ball that has low α dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu. Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, α dose is 0.0200 cph/cmor less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%.

Find Patent Forward Citations

Kawasaki, Hiroyoshi. (2017). Cu ball (U.S. Patent No. 9668358). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9668358

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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