The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
May. 31, 2012
Applicants:
Chih-hao Chen, Hsin-Chu, TW;
Hsien-wen Liu, Hsin-Chu, TW;
Yi-lin Tsai, Tainan, TW;
Jui-pin Hung, Hsin-Chu, TW;
Jing-cheng Lin, Hsin-Chu, TW;
Inventors:
Chih-Hao Chen, Hsin-Chu, TW;
Hsien-Wen Liu, Hsin-Chu, TW;
Yi-Lin Tsai, Tainan, TW;
Jui-Pin Hung, Hsin-Chu, TW;
Jing-Cheng Lin, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/18 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/94 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1531 (2013.01);
Abstract
A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.