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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9653531 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Oct. 14, 2014

Methods of manufacturing a package

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Hsiao-Tsung Yen, Tainan, TW;

Min-Chie Jeng, Taipei, TW;

Hsien-Pin Hu, Zhubei, TW;

Tzuan-Horng Liu, Longtan Township, TW;

Chin-Wei Kuo, Zhubei, TW;

Chung-Yu Lu, Hsin-Chu, TW;

Yu-Ling Lin, Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Matthew Reames

Assistant Examiner:

Steven B Gauthier

Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 21/76885 (2013.01); H01L 23/49822 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 25/0657 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83862 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/19042 (2013.01);
Abstract

A method of manufacturing a package may include: providing a first device having a first redistribution layer (RDL) and an insulator layer disposed over the first RDL; and forming a first micro-bump line over the insulator layer of the first device. The first micro-bump line may extend laterally over a surface of the insulator layer facing away from the first RDL, and a first inductor of the package comprises the first RDL and the first micro-bump line.

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