The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Jun. 18, 2015
Globalfoundries Inc., Grand Cayman, KY;
Jeanne P. Bickford, Essex Junction, VT (US);
Nazmul Habib, South Burlington, VT (US);
Baozhen Li, South Burlington, VT (US);
Tad J. Wilder, South Hero, VT (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
Disclosed are methods for improving integrated circuit (IC) chip reliability. IC chips are manufactured and sorted into groups corresponding to process windows within a process distribution for the design. Group fail rates are set for each group based on failure mechanism fail rates, which are set for multiple failure mechanisms. An overall fail rate is determined for the full process distribution based on the group fail rates. First contribution amounts of the groups to the overall fail rate and second contribution amounts of the failure mechanisms to the group fail rate of each group are determined. Based on an analysis of the contribution amounts, at least one specific failure mechanism is selected and targeted for improvement (i.e., changes directed to the specific failure mechanism(s) are proposed and implemented). Optionally, proposed change(s) are only implemented if they will be sufficient to meet a reliability requirement and/or will not be cost-prohibitive.