The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2017

Filed:

Mar. 18, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Eiichi Shinohara, Yamanashi, JP;

Munetoshi Nagasaka, Yamanashi, JP;

Yoshiyasu Kato, Yamanashl, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/07342 (2013.01); G01R 31/2886 (2013.01); G01R 31/2887 (2013.01); G01R 31/2889 (2013.01);
Abstract

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.


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