The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Aug. 26, 2013
Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Nitta Haas Incorporated, Osaka, JP;
Allen S. Bulick, East Norriton, PA (US);
Hideaki Nishizawa, Kyoto, JP;
Kazuki Moriyama, Kyoto, JP;
Koichi Yoshida, Kyoto, JP;
Shunji Ezawa, Kyoto, JP;
Selvanathan Arumugam, Blue Bell, PA (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Nitta Haas Incorporated, , JP;
Abstract
A method of polishing a sapphire substrate is provided, comprising: providing a substrate having an exposed sapphire surface; providing a chemical mechanical polishing slurry, wherein the chemical mechanical polishing slurry comprises, as initial components: colloidal silica abrasive, wherein the colloidal silica abrasive has a negative surface charge; and, wherein the colloidal silica abrasive exhibits a multimodal particle size distribution with a first particle size maximum between 2 and 25 nm; and, a second particle size maximum between 75 and 200 nm; optionally, a biocide; optionally, a nonionic defoaming agent; and, optionally, a pH adjuster. A chemical mechanical polishing composition for polishing an exposed sapphire surface is also provided.