The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 18, 2017

Filed:

Jun. 03, 2015
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Fang-Hao Hsu, Hsinchu, TW;

Hong-Ji Lee, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 21/762 (2006.01); H01L 21/311 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76229 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/3086 (2013.01); H01L 21/31144 (2013.01); H01L 21/76232 (2013.01); H01L 29/0649 (2013.01);
Abstract

Provided is a method of fabricating a semiconductor device, including the following. A first material layer, a second material layer and a mask layer are formed on a substrate. A portion of the second material layer is removed by performing a first etching process with the mask layer as a mask, so as to expose the first material layer and form a first pattern layer and a second pattern layer. A portion of the first material layer is removed by performing a second etching process with the mask layer as a mask, so as to expose a portion of the substrate. A portion of the substrate is removed by performing a third etching process with the mask layer as a mask, so as to form first trenches and second trenches. Sidewalls of the second trenches and a surface of the substrate form at least two different angles.


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