The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Jul. 07, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/28 (2006.01); H01L 23/522 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/28 (2013.01); H01L 21/31116 (2013.01); H01L 23/5226 (2013.01); H01L 29/0673 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/66606 (2013.01); H01L 21/0217 (2013.01); H01L 21/02167 (2013.01);
Abstract
A method to fabricate a semiconductor device includes forming a semiconductor fin on a substrate; forming a dummy gate material layer over the semiconductor fin; forming a contact hole in the dummy gate material layer; forming a source/drain feature in the contact hole; forming a contact feature on the source/drain feature within the contact hole; and replacing a dummy gate that is formed of the dummy gate material layer with a metal gate.