The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Sep. 16, 2015
Applicant:

Infineon Technologies Americas Corp., El Segundo, CA (US);

Inventors:

Kapil Kelkar, Torrance, CA (US);

Timothy D. Henson, Mount Shasta, CA (US);

Ling Ma, Redondo Beach, CA (US);

Mary Bigglestone, Newport, GB;

Adam Amali, Chandler, AZ (US);

Hugo Burke, Llantrisant, GB;

Robert Haase, San Pedro, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0623 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/66734 (2013.01); H01L 29/7397 (2013.01); H01L 29/7811 (2013.01); H01L 29/7813 (2013.01);
Abstract

A power semiconductor device is disclosed. The power semiconductor device includes a source region in a body region, a gate trench adjacent to the source region, and a source trench electrically coupled to the source region. The source trench includes a source trench conductive filler surrounded by a source trench dielectric liner, and extends into a drift region. The power semiconductor device includes a source trench implant below the source trench and a drain region below the drift region, where the source trench implant has a conductivity type opposite that of the drift region. The power semiconductor device may also include a termination trench adjacent to the source trench, where the termination trench includes a termination trench conductive filler surrounded by a termination trench dielectric liner. The power semiconductor device may also include a termination trench implant below the termination trench.


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