The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Feb. 11, 2015
Applicant:
Xintec Inc., Taoyuan, TW;
Inventors:
Chia-Ming Cheng, New Taipei, TW;
Tsang-Yu Liu, Zhubei, TW;
Chi-Chang Liao, Zhubei, TW;
Yu-Lung Huang, Taoyuan, TW;
Assignee:
XINTEC INC., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3185 (2013.01); H01L 23/3114 (2013.01); H01L 2224/94 (2013.01);
Abstract
A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. A method for forming the chip package is also provided.