The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Sep. 12, 2014
Intel Corporation, Santa Clara, CA (US);
Gaurav Chawla, Tempe, AZ (US);
Joshua D. Heppner, Chandler, AZ (US);
Vijaykumar Krithivasan, Chandler, AZ (US);
Michael Garcia, Chandler, AZ (US);
Kuang C. Liu, Queen Creek, AZ (US);
Rajasekaran Swaminathan, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.