The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Nov. 02, 2011
Applicants:

Masaaki Ito, Hitachinaka, JP;

Hidetoshi Nishiyama, Hitachinaka, JP;

Takahiro Jingu, Takasaki, JP;

Inventors:

Masaaki Ito, Hitachinaka, JP;

Hidetoshi Nishiyama, Hitachinaka, JP;

Takahiro Jingu, Takasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01); G01N 21/47 (2006.01); G01N 21/956 (2006.01); H01L 21/66 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
H04N 7/18 (2013.01); G01N 21/47 (2013.01); G01N 21/956 (2013.01); G01N 21/9501 (2013.01); H01L 22/12 (2013.01); H01L 2924/0002 (2013.01);
Abstract

In a defect inspecting apparatus, the strength of a fatal defect signal decreases due to miniaturization. Thus, in order to assure a high SN ratio, it is necessary to reduce noises caused by scattered light from a wafer. Roughness of a pattern edge and surface roughness which serve as a scattered-light source are spread over the entire wafer. The present invention has discovered the fact that reduction of an illuminated area is a technique effective for decreasing noises. That is to say, the present invention has discovered the fact that creation of an illuminated area having a spot shape and reduction of the dimension of a spot beam are effective. A plurality of temporally and spatially divided spot beams are radiated to the wafer serving as a sample.


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