The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2017
Filed:
May. 08, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Anthony J. Lochtefeld, Ipswich, MA (US);
Thomas A. Langdo, Cambridge, MA (US);
Richard Hammond, Harriseahead, GB;
Matthew T. Currie, Brookline, MA (US);
Eugene A. Fitzgerald, Windham, NH (US);
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01); H01L 21/762 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/165 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7849 (2013.01); H01L 21/28518 (2013.01); H01L 21/76254 (2013.01); H01L 21/76256 (2013.01); H01L 21/76259 (2013.01); H01L 21/76264 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 29/0649 (2013.01); H01L 29/1033 (2013.01); H01L 29/165 (2013.01); H01L 29/41783 (2013.01); H01L 29/66242 (2013.01); H01L 29/66628 (2013.01); H01L 29/66772 (2013.01); H01L 29/66916 (2013.01); H01L 29/7842 (2013.01); H01L 29/78603 (2013.01); H01L 29/78684 (2013.01); H01L 29/78687 (2013.01); H01L 21/76275 (2013.01); H01L 29/66787 (2013.01); H01L 29/785 (2013.01);
Abstract
The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
Lochtefeld, Anthony. (2017). Methods for forming semiconductor device structures (U.S. Patent No. 9601623). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9601623
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile