The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Aug. 10, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Holger Hüsken, Munich, DE;

Anton Mauder, Kolbermoor, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Wolfgang Rösner, Ottobrunn, DE;

Holger Schulze, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/47 (2006.01); H01L 29/32 (2006.01); H01L 29/45 (2006.01); H01L 29/868 (2006.01); H01L 29/36 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 29/32 (2013.01); H01L 29/417 (2013.01); H01L 29/45 (2013.01); H01L 29/47 (2013.01); H01L 29/66136 (2013.01); H01L 29/66143 (2013.01); H01L 29/868 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/36 (2013.01);
Abstract

A semiconductor device includes at least one first contact region of a vertical device between a semiconductor substrate and an electrically conductive structure arranged adjacent to the semiconductor substrate, and at least one second contact region of the vertical device between the semiconductor substrate of the semiconductor device and the electrically conductive structure. The at least one first contact region is arranged adjacent to the at least one second contact region. The electrically conductive structure includes a first electrically conductive material in contact with the semiconductor substrate in an area of the at least one first contact region and a second electrically conductive material in contact with the semiconductor substrate in an area of the at least one second contact region, so that a first contact characteristic within the at least one first contact region differs from a second contact characteristic within the at least one second contact region.


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