The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Mar. 13, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); G03F 7/16 (2006.01); G03F 7/11 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0271 (2013.01); G03F 7/11 (2013.01); G03F 7/167 (2013.01); H01L 21/0273 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/31133 (2013.01); H01L 21/6708 (2013.01);
Abstract
A method of semiconductor device fabrication including placing a substrate having a first and second features disposed thereon in a vaporizing spray deposition system. An atomizing spray head of the vaporizing spray deposition system is used to deposit a conformal polymer layer on the first and second features. The first feature having the layer of the polymer disposed thereon and having a first width. A spray trim process is performed on the first and second features having the polymer layer disposed thereon using the atomizing spray head.