The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Jun. 21, 2013
Applicant:
Cheil Industries, Inc., Gumi-si, Gyeongsangbuk-do, KR;
Inventors:
Jong Il Noh, Uiwang-si, KR;
Dong Hun Kang, Uiwang-si, KR;
Tae Wan Kim, Uiwang-si, KR;
Jeong Hwan Jeong, Uiwang-si, KR;
Young Nam Choi, Uiwang-si, KR;
Chang Ki Hong, Uiwang-si, KR;
Assignee:
CHEIL INDUSTRIES, INC., Gumi-Si, Gyeongsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1463 (2013.01); H01L 21/3212 (2013.01);
Abstract
The present invention relates to a CMP slurry composition for polishing copper, comprising: polishing particles; a complexing agent; a corrosion inhibitor; and deionized water. The complexing agent comprises one or more organic acids selected from oxalic acid, malic acid, malonic acid, and formic acid, and glycine.