The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
May. 23, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chih-Hsiang Huang, Zhubei, TW;
Da-Wen Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method comprises forming a first fin and a second fin over a substrate, wherein the first fin and the second fin are separated by a trench, applying a first pre-amorphous implantation (PAI) process to the substrate and forming a first PAI region underlying the trench as a result of the first PAI process, depositing a first tensile film layer on sidewalls and a bottom of the trench, converting the first PAI region into a first dislocation plane underlying the trench using a first anneal process and forming an isolation region over the first dislocation plane.