The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Oct. 19, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ruqiang Bao, Wappingers Falls, NY (US);

Unoh Kwon, Fishkill, NY (US);

Huihang Dong, Ridgefield, CT (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/283 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 21/283 (2013.01); H01L 21/823828 (2013.01); H01L 27/092 (2013.01); H01L 29/4966 (2013.01);
Abstract

An IC structure including: a first replacement gate stack for the pFET, the first replacement gate stack including: an interfacial layer in a first opening in the dielectric layer; a high-k layer over the interfacial layer in the first opening; a pFET work function metal layer over the high-k layer in the first opening; and a first gate electrode layer over the pFET work function metal layer and substantially filling the first opening; and a second replacement gate stack for the nFET, the second gate stack laterally adjacent to the first gate stack and including: the interfacial layer in a second opening in the dielectric layer; the high-k layer over the interfacial layer in the second opening; a nFET work function metal layer over the high-k layer in the second opening; and a second gate electrode layer over the nFET work function metal layer and substantially filling the second opening.


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