The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Nov. 07, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiaolan Ba, San Jose, CA (US);

Weifeng Ye, San Jose, CA (US);

Mei-yee Shek, Palo Alto, CA (US);

Yu Jin, Santa Clara, CA (US);

Li-Qun Xia, Cupertino, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Alexandros T. Demos, Fremont, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); C23C 16/44 (2006.01); C23C 16/36 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/56 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4408 (2013.01); C23C 16/36 (2013.01); C23C 16/45523 (2013.01); C23C 16/50 (2013.01); C23C 16/56 (2013.01); H01L 21/76826 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/02167 (2013.01);
Abstract

Embodiments described herein generally relate to the formation of a UV compatible barrier stack. Methods described herein can include delivering a process gas to a substrate positioned in a process chamber. The process gas can be activated to form an activated process gas, the activated process gas forming a barrier layer on a surface of the substrate, the barrier layer comprising silicon, carbon and nitrogen. The activated process gas can then be purged from the process chamber. An activated nitrogen-containing gas can be delivered to the barrier layer, the activated nitrogen-containing gas having a N:NHratio of greater than about 1:1. The activated nitrogen-containing gas can then be purged from the process chamber. The above elements can be performed one or more times to deposit the barrier stack.


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