The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2017

Filed:

Aug. 01, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kousuke Yoshihara, Koshi, JP;

Hideharu Kyouda, Koshi, JP;

Koshi Muta, Koshi, JP;

Taro Yamamoto, Koshi, JP;

Yasushi Takiguchi, Koshi, JP;

Masahiro Fukuda, Koshi, JP;

Assignee:

Tokyo Electron Limited, Minato-Ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/12 (2006.01); G03F 7/30 (2006.01); B05C 5/02 (2006.01); B05D 1/00 (2006.01); B05C 11/08 (2006.01); B05D 1/26 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G03F 7/30 (2013.01); G03F 7/3021 (2013.01); B05C 5/02 (2013.01); B05C 11/08 (2013.01); B05D 1/005 (2013.01); B05D 1/26 (2013.01); H01L 21/6715 (2013.01);
Abstract

A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.


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