The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

May. 25, 2016
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventors:

Hiroshi Akasaka, Kawasaki, JP;

Masayoshi Ikeda, Kawasaki, JP;

Kazuhiro Kimura, Kawasaki, JP;

Yasushi Kamiya, Kawasaki, JP;

Tomohiko Toyosato, Kawasaki, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C23C 14/04 (2006.01); C23C 14/58 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/285 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76865 (2013.01); C23C 14/046 (2013.01); C23C 14/5833 (2013.01); H01L 21/2855 (2013.01); H01L 21/28556 (2013.01); H01L 21/76802 (2013.01); H01L 21/76843 (2013.01); H01L 21/76862 (2013.01); H01L 21/76877 (2013.01); H01L 29/66545 (2013.01); H01L 29/7843 (2013.01); C23C 14/5873 (2013.01); C23C 16/56 (2013.01);
Abstract

An object of the present invention is to provide a method which enable a material to be fully embedded into a recess portion with a deposition film left in the recess portion. A method in one embodiment comprises: a first irradiation step of irradiating a deposition film formed on an opening portion of a recess portion in a substrate with a particle beam in a direction at a first angle with respect to a substrate in-plane direction, to remove part of the deposition film in a thickness direction; and a second irradiation step of, after the first irradiation step, irradiating the deposition film with the particle beam in a direction at a second angle which is closer to perpendicular to the substrate in-plane direction than the first angle is, to remove part of the remaining deposition film in the thickness direction.


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