The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Apr. 05, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akihito Ohno, Tokyo, JP;

Masashi Sakai, Tokyo, JP;

Yoichiro Mitani, Tokyo, JP;

Takahiro Yamamoto, Tokyo, JP;

Yasuhiro Kimura, Tokyo, JP;

Takuma Mizobe, Tokyo, JP;

Nobuyuki Tomita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/44 (2006.01); B08B 9/093 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02529 (2013.01); B08B 9/093 (2013.01); C23C 16/4412 (2013.01); C23C 16/455 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01);
Abstract

A manufacturing method for manufacturing a silicon carbide epitaxial wafer includes: introducing a cleaning gas into a growth furnace to remove dendrite-like polycrystal of silicon carbide attached to an inner wall of the growth furnace; after introducing the cleaning gas, bringing a silicon carbide substrate in the growth furnace; and growing a silicon carbide epitaxial layer on the silicon carbide substrate by introducing a processing gas into the growth furnace to manufacture a silicon carbide epitaxial wafer, wherein the cleaning gas having fluid energy of 1.6E-4 [J] or higher is introduced into the growth furnace.


Find Patent Forward Citations

Loading…