The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jul. 11, 2014
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Eiichi Shinohara, Nirasaki, JP;

Kenji Yamaguchi, Tokyo, JP;

Masataka Hatta, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 31/319 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01R 1/0491 (2013.01); G01R 1/067 (2013.01); G01R 31/2862 (2013.01); G01R 31/2879 (2013.01); G01R 31/31905 (2013.01);
Abstract

A probe apparatus can suppress a spark from occurring near a wafer surface simply and efficiently when inspecting electrical characteristics of a semiconductor device at wafer level. A spark preventing devicemounted in the probe apparatus includes a surrounding memberwhich surrounds probe needlesG andS between a probe cardand a mounting table; and a gas supply deviceconfigured to supply a gas to a vicinity of the probe needlesG andS through an inside or a vicinity of the surrounding memberto form an atmosphere of a preset pressure higher than an atmospheric pressure in the vicinity of the probe needlesG andS when inspecting the electrical characteristics of each chip on a semiconductor wafer W. A contact platealso serves as the surrounding member


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