The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Sep. 18, 2014
Applicant:

Ultratech, Inc., San Jose, CA (US);

Inventors:

Andrew M. Hawryluk, Lost Altos, CA (US);

Serguel Anikitchev, Belmont, CA (US);

Assignee:

Ultratech, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B23K 26/08 (2014.01); H01L 21/67 (2006.01); B23K 26/00 (2014.01); B23K 26/03 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); B23K 26/00 (2013.01); B23K 26/034 (2013.01); B23K 26/08 (2013.01); H01L 21/02675 (2013.01); H01L 21/67248 (2013.01); B23K 2203/56 (2015.10); H01L 21/00 (2013.01);
Abstract

Laser annealing systems and methods for annealing a semiconductor wafer with ultra-short dwell times are disclosed. The laser annealing systems can include one or two laser beams that at least partially overlap. One of the laser beams is a pre-heat laser beam and the other laser beam is the annealing laser beam. The annealing laser beam scans sufficiently fast so that the dwell time is in the range from about 1 μs to about 100 μs. These ultra-short dwell times are useful for annealing product wafers formed from thin device wafers because they prevent the device side of the device wafer from being damaged by heating during the annealing process. Embodiments of single-laser-beam annealing systems and methods are also disclosed.


Find Patent Forward Citations

Loading…