The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2017

Filed:

Feb. 22, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Inatomi, Nirasaki, JP;

Takashi Tanaka, Nirasaki, JP;

Nobutaka Mizutani, Nirasaki, JP;

Yusuke Saito, Nirasaki, JP;

Mitsuaki Iwashita, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); C23C 18/16 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); C23C 18/163 (2013.01); C23C 18/1619 (2013.01); C23C 18/1669 (2013.01); C23C 18/1676 (2013.01); H01L 21/76849 (2013.01);
Abstract

A plating apparatusincludes a substrate holding deviceconfigured to hold and rotate the substrate; a first discharge deviceconfigured to discharge a plating liquid toward the substrateheld on the substrate holding device; and a top platethat is provided above the substrateand has an opening. The first discharge deviceincludes a first discharge unitconfigured to discharge the plating liquid toward the substrate, and the first discharge unitis configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unitis configured to be overlapped with the openingof the top plateat the discharge position.


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