The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2017

Filed:

Jul. 02, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Huan-En Lin, Kaohsiung, TW;

Shiu-Ko Jangjian, Tainan, TW;

Volume Chien, Tainan, TW;

Fu-Tsun Tsai, Tainan, TW;

Yung-Lung Hsu, Tainan, TW;

Chi-Cherng Jeng, Tainan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 27/1464 (2013.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14689 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01);
Abstract

A backside illuminated (BSI) image sensor device includes: a first substrate including a front side and a back side; a second substrate bonded with the first substrate on the front side; and a blocking layer between the first substrate and the second substrate. The first substrate includes an image sensor, and the image sensor is configured to collect incident light entering from the back side. The second substrate includes a circuit coupled with the image sensor. The blocking layer is configured to block radiation induced by the circuit.


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