The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2017
Filed:
Dec. 23, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Inventors:
Chin-Yi Cho, Kaohsiung, TW;
Yi-Chuan Teng, Hsinchu County, TW;
Shang-Ying Tsai, Taoyuan County, TW;
Li-Min Hung, Taoyuan County, TW;
Yao-Te Huang, Hsinchu, TW;
Jung-Huei Peng, Hsinchu Hsien, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/36 (2014.01); B28D 5/00 (2006.01); B08B 7/02 (2006.01); B23K 26/40 (2014.01); C03B 33/02 (2006.01);
U.S. Cl.
CPC ...
B23K 26/365 (2013.01); B08B 7/02 (2013.01); B23K 26/362 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B28D 5/0076 (2013.01); B23K 2203/50 (2015.10); C03B 33/0222 (2013.01);
Abstract
According to an exemplary embodiment of the disclosure, a method of removing a waste part of a substrate is provided. The method includes: using a laser to partially drill the substrate to define the waste part; and applying megasonic vibration to the substrate to remove the waste part from the substrate.