The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Mar. 13, 2008
Applicants:

Rajinder Dhindsa, Fremont, CA (US);

Eric Hudson, Fremont, CA (US);

Alexei Marakhtanov, Fremont, CA (US);

Maryam Moravej, Fremont, CA (US);

Andreas Fischer, Fremont, CA (US);

Inventors:

Rajinder Dhindsa, Fremont, CA (US);

Eric Hudson, Fremont, CA (US);

Alexei Marakhtanov, Fremont, CA (US);

Maryam Moravej, Fremont, CA (US);

Andreas Fischer, Fremont, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32642 (2013.01); H01J 37/32091 (2013.01); H01J 37/32174 (2013.01); H01J 37/32623 (2013.01); H01J 37/32697 (2013.01);
Abstract

In a plasma processing chamber, a method for processing a substrate is provided. The method includes supporting the substrate in the plasma processing chamber configured with an upper electrode (UE) and a lower electrode (LE), configuring at least one radio frequency power source to ignite plasma between the UE and the LE, and providing a conductive coupling ring, the conductive coupling ring is coupled to the LE to provide a conductive path. The method further includes providing a plasma-facing-substrate-periphery (PFSP) ring, the PFSP ring being disposed above the conductive coupling ring. The method yet further includes coupling the PFSP ring to at least one of a direct current (DC) ground through an RF filter, the DC ground through the RF filter and a variable resistor, a positive DC power source through the RF filter, and a negative DC power source through the RF filter to control plasma processing parameters.


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