The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2016

Filed:

Jul. 25, 2014
Applicant:

Sandisk Technologies, Inc., Plano, TX (US);

Inventors:

Jayavel Pachamuthu, San Jose, CA (US);

Johann Alsmeier, San Jose, CA (US);

Henry Chien, San Jose, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11551 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11578 (2013.01); H01L 27/11582 (2013.01);
Abstract

A method of fabricating a semiconductor device, such as a three-dimensional NAND memory string, includes forming a carbon etch stop layer having a first width over a major surface of a substrate, forming a stack of alternating material layers over the etch stop layer, etching the stack to the etch stop layer to form a memory opening having a second width at a bottom of the memory opening that is smaller than the width of the etch stop layer, removing the etch stop layer to provide a void area having a larger width than the second width of the memory opening, forming a memory film over a sidewall of the memory opening and in the void area, and forming a semiconductor channel in the memory opening such that the memory film is located between the semiconductor channel and the sidewall of the memory opening.


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