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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9523912 B1

PDFFull Text
Date of Patent:
Dec. 20, 2016

Filed:

Aug. 31, 2015

Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device, electronic device and compound

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Shohei Kataoka, Shizuoka, JP;

Akinori Shibuya, Shizuoka, JP;

Toshiaki Fukuhara, Shizuoka, JP;

Hajime Furutani, Shizuoka, JP;

Michihiro Shirakawa, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/038 (2006.01); C07C 233/04 (2006.01); C07C 311/06 (2006.01); C07C 235/88 (2006.01); C07C 311/03 (2006.01); C08F 220/26 (2006.01); H01L 21/027 (2006.01); C07D 327/06 (2006.01); C07D 333/46 (2006.01); C07D 333/76 (2006.01); C07C 311/51 (2006.01); C07C 311/53 (2006.01); C07D 411/06 (2006.01); C07C 381/12 (2006.01); C07C 25/18 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/039 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); C07C 25/18 (2013.01); C07C 233/04 (2013.01); C07C 235/88 (2013.01); C07C 311/03 (2013.01); C07C 311/06 (2013.01); C07C 311/51 (2013.01); C07C 311/53 (2013.01); C07C 381/12 (2013.01); C07D 327/06 (2013.01); C07D 333/46 (2013.01); C07D 333/76 (2013.01); C07D 411/06 (2013.01); C08F 220/26 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/20 (2013.01); G03F 7/325 (2013.01); H01L 21/0275 (2013.01); C07C 2101/14 (2013.01); C07C 2103/74 (2013.01);
Abstract

There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.

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