The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Oct. 17, 2014
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Allen Park, San Jose, CA (US);
Craig MacNaughton, Los Gatos, CA (US);
Ellis Chang, Saratoga, CA (US);
Assignee:
KLA-Tencor Corp., Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/06 (2006.01); G01N 21/88 (2006.01); G03F 7/00 (2006.01); G01N 21/93 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G01N 21/93 (2013.01); G01B 11/0675 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G03F 7/705 (2013.01); G03F 7/70616 (2013.01); G01B 11/06 (2013.01); G01B 2210/56 (2013.01); G01N 2201/061 (2013.01); G01N 2201/105 (2013.01); G01N 2201/11 (2013.01); G01N 2201/125 (2013.01);
Abstract
Methods and systems for determining one or more parameters of a wafer inspection process are provided. One method includes acquiring metrology data for a wafer generated by a wafer metrology system. The method also includes determining one or more parameters of a wafer inspection process for the wafer or another wafer based on the metrology data.