The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9502310 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 22, 2016

Filed:

Mar. 23, 2016
Applicant:

Peking University, Beijing, CN;

Inventors:

Ming Li, Beijing, CN;

Yuancheng Yang, Beijing, CN;

Gong Chen, Beijing, CN;

Jiewen Fan, Beijing, CN;

Hao Zhang, Beijing, CN;

Ru Huang, Beijing, CN;

Assignee:

PEKING UNIVERSITY, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/8238 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 29/08 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823885 (2013.01); H01L 21/02603 (2013.01); H01L 21/02636 (2013.01); H01L 21/3081 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 29/0649 (2013.01); H01L 29/0676 (2013.01); H01L 29/0847 (2013.01); H01L 29/66545 (2013.01);
Abstract

The present invention discloses a method for integrating a vertical nanowire transistor and belongs to a field of field effect transistor logic device in a CMOS ultra-large scale integrated circuit (ULSI). The method realizes the integration of the vertical-nanowire transistor by combining selective epitaxy and replacement gate on sidewall. In comparison with an existing method for forming a vertical nanowire channel by etching, a size and shape of a cross section of a device channel can be accurately controlled, a consistency of device characteristic can be improved, and an etching damage during the forming of a channel in the existing method can be avoided, thereby the device performance can be improved.


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