The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2016

Filed:

Jul. 14, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chun Hsiung Tsai, Xinpu Township, TW;

Tsan-Yao Chen, Jhubei, TW;

Jian-An Ke, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823418 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/02532 (2013.01); H01L 21/02576 (2013.01); H01L 21/02636 (2013.01); H01L 21/02639 (2013.01); H01L 21/02658 (2013.01); H01L 21/02664 (2013.01); H01L 29/66477 (2013.01); H01L 29/66628 (2013.01); H01L 29/66636 (2013.01); H01L 29/7834 (2013.01); H01L 29/7848 (2013.01);
Abstract

The embodiments of mechanisms for forming source/drain (S/D) regions of field effect transistors (FETs) described uses Clas an etchant during the epitaxial formation of the S/D regions. The mechanisms involve using an asymmetric cyclic deposition and etch (ACDE) process that forms a preparation layer enable epitaxial growth of the following epitaxial layer with transistor dopants. The mechanisms also involve soaking the surface of substrate with dopant-containing precursors to enable sufficient incorporation of transistor dopants during the epitaxial growth of the S/D regions. By using Clas etchants, the mechanisms also enables high throughput of the epitaxial growth of the S/D regions.


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