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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9502271 B1

PDFFull Text
Expired
Date of Patent:
Nov. 22, 2016

Filed:

Jun. 20, 2014

Warpage control for flexible substrates

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chen-Hua Yu, Hsin-Chu, TW;

Shih Ting Lin, Taipei, TW;

Jing-Cheng Lin, Chu Tung Zhen, TW;

Shang-Yun Hou, Jubei, TW;

Szu Wei Lu, Hsin-Chu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Phat X Cao

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 21/56 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 23/562 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 21/563 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/058 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05794 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/16 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81409 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Flexible structures and method of providing a flexible structure are disclosed. In some embodiments, a method of providing a flexible structure includes: providing a flex substrate having a device bonded to a first side of the flex substrate; and attaching a rigid layer to a second side of the flex substrate opposite the first side using an adhesive layer.

Find Patent Forward Citations

Yu, Chen-Hua. (2016). Warpage control for flexible substrates (U.S. Patent No. 9502271). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9502271

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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