The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
May. 08, 2015
Hitachi Kokusai Electric Inc., Tokyo, JP;
AZ Electronic Materials (Luxembourg) S.a.r.i., Luxembourg, LU;
Masahisa Okuno, Toyama, JP;
Tooru Kakuda, Toyama, JP;
Hideto Tateno, Toyama, JP;
Takuya Joda, Toyama, JP;
Masamichi Kurokawa, Kakegawa, JP;
HITACHI KOKUSAI ELECTRIC INC., Tokyo, JP;
AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L., Luxembourg, LU;
Abstract
There is provided a substrate processing method, including: (a) loading a substrate into a processing vessel having a pre-baked film containing a silazane bond; (b) heating the substrate to a first temperature and supplying a process gas to the heated substrate; and (c) heating the substrate to which the process gas has been supplied, to a second temperature which is higher than the first temperature and less than or equal to a temperature at which the pre-bake has been performed.