The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2016
Filed:
Aug. 27, 2012
Yun Wang, Saratoga, CA (US);
Andrew M. Hawryluk, Los Altos, CA (US);
Xiaoru Wang, Fremont, CA (US);
Xiaohua Shen, Fremont, CA (US);
Yun Wang, Saratoga, CA (US);
Andrew M. Hawryluk, Los Altos, CA (US);
Xiaoru Wang, Fremont, CA (US);
Xiaohua Shen, Fremont, CA (US);
Ultratech, Inc., San Jose, CA (US);
Abstract
Methods of annealing a thin semiconductor wafer are disclosed. The methods allow for high-temperature annealing of one side of a thin semiconductor wafer without damaging or overheating heat-sensitive electronic device features that are either on the other side of the wafer or embedded within the wafer. The annealing is performed at a temperature below the melting point of the wafer so that no significant dopant redistribution occurs during the annealing process. The methods can be applied to activating dopants or to forming ohmic contacts.