The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Jan. 07, 2015
Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Hiroyuki Komatsu, Tokyo, JP;

Takehiko Naruoka, Tokyo, JP;

Shinya Minegishi, Tokyo, JP;

Kaori Sakai, Tokyo, JP;

Tomoki Nagai, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/02 (2006.01); C23F 1/12 (2006.01); G03F 7/00 (2006.01); H01L 21/308 (2006.01); C08F 297/02 (2006.01); C09D 153/00 (2006.01);
U.S. Cl.
CPC ...
C23F 1/02 (2013.01); C08F 297/02 (2013.01); C09D 153/00 (2013.01); C23F 1/12 (2013.01); G03F 7/0002 (2013.01); H01L 21/3081 (2013.01);
Abstract

A pattern-forming method includes providing a metal-containing film directly or indirectly on a substrate. A directed self-assembling film is provided directly or indirectly on the metal-containing film such that a plurality of phases of the directed self-assembling film is formed. At least a part of the plurality of phases of the directed self-assembling film is removed such that a pattern of the directed self-assembling film is formed. The metal-containing film and the substrate are sequentially etched using the pattern of the directed self-assembling film as a mask.


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