The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Oct. 29, 2013
Applicant:

Fujimi Incorporated, Kiyosu-shi, Aichi, JP;

Inventors:

Shogo Onishi, Kiyosu, JP;

Yasuto Ishida, Kiyosu, JP;

Tatsuhiko Hirano, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); C09G 1/02 (2013.01); C09K 3/1445 (2013.01); C09K 3/1463 (2013.01); H01L 21/3212 (2013.01);
Abstract

[Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate. [Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.


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